HemeraHT
Rapid Thermal Annealing System for Research & High‑Volume Production

The HemeraHT is available in two configuration levels to meet different operational needs:

a manual version for flexible, hands‑on control
an automatic version for fully integrated, high‑throughput workflows.

This dual‑configuration approach makes the system ideal for a wide range of rapid thermal processing applications, including rapid thermal annealing, rapid thermal oxidation, and advanced wafer‑level heat treatments. Its versatility enables seamless use in research environments as well as scalable semiconductor manufacturing setups.

1. Rapid Thermal Processing Applications

The HemeraHT is a high‑performance rapid thermal processing (RTP) system designed for a broad spectrum of semiconductor applications that require fast, precise and contamination‑free thermal treatment. Its dual‑side lamp heating and vacuum‑based process chamber make it suitable for both advanced R&D environments and high‑volume manufacturing. The wafer processing equipment supports a wide range of thermal steps, including:

Implant annealing and dopant activation for silicon and compound semiconductors such as GaAs, GaN, SiC, etc.
Rapid thermal annealing (RTA) for CMOS, MEMS, power devices and optoelectronics
Oxidation and nitridation processes requiring short cycle times and controlled ambient conditions including multi-step processing such as ONO (Oxidation – Nitridation – Oxidation)
Interface engineering for gate stacks, dielectric layers and surface passivation
Ohmic contact formation
Silicide formation (NiSi, CoSi2, TiSi2)
Multi-Spike GaN processing
Densification
COP (Crystal Originated Particle) annealing
Thermal treatments for sensitive structures, where low thermal budgets and precise ramp rates are essential

With its flexible wafer handling options and robust process control, the HemeraHT is ideal for fabs and research facilities working on next‑generation device technologies.

2. Key Technology Advantages for Semiconductor Thermal Processing

The HemeraHT rapid thermal processor combines advanced lamp‑based heating technology with a stable vacuum environment to deliver exceptional thermal performance and process reliability. Its architecture is engineered to meet the stringent requirements of modern semiconductor manufacturing:

Dual‑side lamp field for highly uniform energy distribution and minimized thermal gradients
Fast ramp rates enabling low thermal budget processing and reduced dopant diffusion
Vacuum chamber design for contamination‑free processing and precise ambient control
Independent lamp and power control
Excellent within‑wafer and wafer‑to‑wafer uniformity
Optional wafer rotation
Spike annealing
Ultra-fast cooling capability
Modular system configuration, available as manual‑load or fully automated EFEM version
Flexible process ambient control, supporting inert, oxidizing or specialty gas atmospheres

These advantages make the HemeraHT a powerful platform for both advanced device development and high‑volume manufacturing.

3. Performance & Process Capabilities

Built for exceptional flexibility and precision, the HemeraHT handles an extensive range of thermal processes and wafer dimensions. Wafer sizes can be rapidly changed, enabling fast adaptation to evolving process requirements. Tailored for both research and process development, the system can be seamlessly upgraded to meet the demands of pilot production or full‑scale manufacturing in wafer fabrication.

Wafer size support from 50 mm to 200 mm
Easy adaptation to different wafer sizes and geometries
High within‑wafer and wafer‑to‑wafer uniformity, even at elevated temperatures
Stable temperature control with precise ramp‑up and cool‑down profiles
For low temperature processing (< 650°C) HQ-D offers its proprietary low-T pyrometer
Configurable process recipes for annealing, oxidation, nitridation and specialty thermal steps
Compatibility with multi‑wafer carriers, susceptors and custom wafer holders
Integrated edge guard ring enhances temperature uniformity across the wafer or graphite susceptor or box
Repeatable results suitable for both pilot lines and high‑volume production

This performance profile ensures that the HemeraHT can be integrated into demanding process flows with confidence.

4. Integration & Automation

The HemeraHT wafer processing equipment is designed for seamless integration into modern semiconductor fabs, pilot lines and research environments. Its automation and handling options support efficient, scalable and contamination‑controlled operation:

Manual system for R&D and academic research
Automatic handling system (equipment front end module, EFEM)
Optional EFEM automation for 300 mm wafers, including FOUP handling
Optional vacuum cooling chamber
Flexible loading options for small wafers, carriers, boxes or susceptors
The system can be equipped with two sender and two receiver cassette stations allowing continuous processing or pick and place operation
Compact cleanroom footprint (only 3 m²) optimized for space‑constrained environments
Modular subsystem design for simplified maintenance and reduced downtime
Industry‑standard communication interfaces for fab‑wide integration

These features ensure smooth operation, easy serviceability and long‑term reliability in production environments.

Discover More:

Learn about the related Hyperion LT low temperature microwave plasma oxidation and nitridation system.

We also offer various pyrometers with multiple measurement wavelengths and bandwidths