Hemera HT

The HemeraHT rapid thermal processing equipment (RTP) is based on a dual side lamp field vacuum chamber concept. The HemeratHT is either available with automatic or manual loading and for wafer sizes up to 200 mm.
Our automatic handling system (equipment front end module, EFEM) including fab automation for up to 300 mm wafer size is optional capable for small wafer sizes (50 – 100 mm), multi wafer processing or automatic susceptor or box handling for wide band gab semiconductors.